菜单
05.06.2025

Foaming and Potting Processes with PUR for Individual Parts and Assemblies PUR Potting and Foaming: The Optimal Protection for Your Electromechanical and Electronic Components

In today’s electronics manufacturing, protection, reliability, and longevity of components are essential quality features. Components must withstand increasingly demanding conditions — from extreme temperatures and moisture to dust, mechanical stress, and chemical influences. To meet these challenges, PUR foam and potting solutions are increasingly being used.
Image source: Henkel

In today’s electronics manufacturing, protection, reliability, and longevity of components are essential quality features. Components must withstand increasingly demanding conditions — from extreme temperatures and moisture to dust, mechanical stress, and chemical influences. To meet these challenges, PUR foam and potting solutions are increasingly being used.

PUR Potting: Tailored All-Round Protection for Sensitive Electronics
The use of PUR potting compounds is one of the most efficient methods for the complete encapsulation of electronic and electromechanical components. The potting process ensures that components are fully and seamlessly enclosed, creating a dense and durable protective barrier. This reliably shields against moisture, dust, dirt, and mechanical loads such as shock or vibration. Due to the elastic properties of PUR, impacts can be effectively absorbed, significantly extending the service life of sensitive components.

Benefits of PUR Potting for Electronic Modules:

Optimal Protection

PUR potting compounds form a dense, seamless enclosure around electronic components, providing optimal protection against:

  • Moisture:PUR acts as an effective barrier against moisture, which can cause corrosion and short circuits.
  • Dust and Dirt:Contaminants can impair the function of electronic components. PUR prevents foreign particles from entering.
  • Mechanical Stresses:Shocks, vibrations, and impacts can damage delicate components. PUR offers excellent damping.
  • Temperature Fluctuations:PUR compounds are generally resistant to temperature extremes, protecting electronics from overheating or freezing.

Additionally, PUR potting is used for electrical insulation. This reliably prevents short circuits, significantly increasing the safety and functional stability of electronics. PUR also offers excellent chemical resistance — a wide range of industrial chemicals, oils, or cleaning agents have little effect on the material, further enhancing protection against corrosive influences.

Particularly noteworthy is the enormous flexibility in selecting and adapting the PUR system: properties such as hardness, viscosity, pot life, curing time, and more can be precisely tailored to the specific application requirements. As a result, both rigid and flexible potting materials can be used — depending on whether mechanical stabilization or high flexibility is needed.

Another benefit is the ease of processing: modern dispensing and mixing systems allow PUR potting compounds to be applied with high precision and efficiency. Despite their protective performance, PUR foams and potting materials add little weight to the component — a clear advantage, especially for applications in the automotive sector or portable devices.

PUR Foams: Flexible Solutions for Complex Geometries and Lightweight Applications

PUR foams complement traditional potting wherever hollow structures need to be filled or particularly lightweight protective layers are required. Despite their low weight, PUR foams offer high mechanical stability and effective shock absorption.

Thanks to their excellent flow properties, they adapt easily to complex component geometries, ensuring complete filling of cavities. Their insulating properties also contribute to the thermal optimization of sensitive electronics.

Application Examples

  • Electronics in Harsh Environments: PUR potting compounds protect electronics in environments with high humidity, dust, or strong vibrations — for example in industrial or automotive settings.
  • PCBs (printed circuit boards): PUR potting protects printed circuit boards from corrosion and mechanical damage.
  • Sensors: PUR potting shields sensitive sensors from external influences, ensuring reliable performance.
  • Batteries: PUR potting protects batteries from moisture and mechanical stress.

Our PUR Foam and Potting Systems

Function and Design

  • Dosing Components: High-precision pumps dose the two main components of PUR (polyol and isocyanate) in the exact required ratio.
  • Static Mixers: Ensure a homogeneous mixture of the components on a molecular level, resulting in a uniform reaction and optimal product properties.
  • Mixing Head: The mixing head is the heart of the system. Here, the two components are intensively blended just before exiting the nozzle.
  • Control and Regulation Technology: State-of-the-art controllers enable precise regulation of all process parameters such as dosing quantity, mixing ratio, and curing time.
  • Gasket Foams: Production of highly precise seals for the automation, medical, and railway industries.
  • Precision: High dosing accuracy and optimal mixing of components.
  • Flexibility: Adaptable to different PUR systems and component geometries.
  • Efficiency: High production speeds and low scrap rates.
  • Quality: Reproducible results and high product quality.
  • Environmental Friendliness: Minimization of material waste and use of eco-friendly materials.

Advantages of PUR Two-Component Foam Systems

  • Fast curing for efficient production processes
  • Strong adhesion to various materials
  • Wide range of customization options through specific formulations
  • Easy application and processing across different production setups

Consulting and Implementation

Our team at binder solutions offers consulting on individual processes as a service — from foam and potting applications to the development of complete system assemblies tailored to your specific requirements.

+86 (0) 25 8332 8591 联系表格